MAT6400 Flip Chip Bonder | |
![model-6400 model-6400](/images/default-source/technology-development-centre_cc/model-6400.jpg?sfvrsn=8296e6c7_0&MaxWidth=500&MaxHeight=450&ScaleUp=false&Quality=High&Method=ResizeFitToAreaArguments&Signature=A795CE73C5E2878DDC31C21D7E2D467134153212) | ![Flipchipbonder Flipchipbonder](/images/default-source/technology-development-centre_cc/flipchipbonder3a96e1f3aab342b7afb047ddaed25efd.jpg?sfvrsn=d725a3b9_0) |
Capability
This bonder performs die attach and interconnect processes for MCM, flip chip, eutectic, and ultrasonic assemblies.
Specifications
- Work Area: Up to 10” x 12”
- Die size range: 0.2 mm to 25 mm
- Die presentation: 2”/4” waffle/gel packs
- Accuracy: ±3um
- Volumetric dispenser with programmable dispense time, dwell time, reverse time, dispense height and shape parameters
Applications
- Multi chip modules, imaging devices, sensors and MEMS devices
- Full flip chip process including chip flipping, bump fluxing and chip final alignment over up looking camera
- Capillary underfillprocess to enhance solder joint reliability